Compound for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics. Applicable for use in electronic assemblies to prevent vibration damage, encapsulate circuits for the purpose of technological protection. RoHS compliant.
Product Features :
Extreme physical strength and chemical resistance
Maximum service temperature of 275 degree C (527 degree F)
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