FOXCUP
Hardware Adhesives & Sealers
Hardware Adhesives & Sealers By FOXCUP
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MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits, Read Description Below - Product Features
- Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation
- Large Mass, Thick Cross-Section, Low Exothermic Heat Generation
- Lower Viscosity Compared To Other Thermally Conductive Potting Compound
- Insulates AC/DC Current, Suitable For High And Low Voltage Insulating
- Long Working Time - Cures In 24 Hours @ 25 degree C- Heat Curable For Faster Processing
MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits, Read Description Below - Product Features
- Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation
- Large Mass, Thick Cross-Section, Low Exothermic Heat Generation
- Lower Viscosity Compared To Other Thermally Conductive Potting Compound
- Insulates AC/DC Current, Suitable For High And Low Voltage Insulating
- Long Working Time - Cures In 24 Hours @ 25?C- Heat Curable For Faster Processing
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